Subpage for VemsExecutives
Because of time pressure ( WBO2 , display, ArmEfi design ):
- Marcell Gal is casedesign executive
- Fero (Ferenc Kulin) is vice executive
Prepared
- 500 round cases ordered, will be manufactured any day now. Main issues:
- outer dia was chosen as min 51.8 .. max 51.9mm because noone confirmed that 52mm is safe - if the drill is 52mm we need some clearance. Maybe 52mm is safe?
- internal diameter at the PCB = 47.8 .. 47.9 mm. This needs to be fixed eg. by a design change: the undersized 47.9mm internal dia steps up to 48.8mm or more (upto 49.8mm) between the seger and the PCB
- total height of the assembled board: 12mm seems to be worstcase (BA56-126GWA display), so 13 .. 15mm internal space should be very safe (17mm in first batch, and even more available with glue instead of endplate).
- a few types can be made, eg.:
- 350 with full-round plexi window (harder to get wrong)
- 150 with 36*17mm (centrally positioned) rectangular plexi window. Also 9xdia=3.1mm for throughole LEDs and 1xdia=5.1mm for pushbutton (Jorgen defined the coordinates in dxf in Smalldisplay_case.zip file).
- 500+ pushbutton caps with appr. 5mm dia, 9.5 .. 10mm total height (slightly rounded top, height at center is bigger). Total height formula: 10mm = BA5612GWA + plexi + Al + stickout - SDTM610 = 8+3+1+ stickout - 4.35 mm where stickout=2.35 mm (central part sticks out 2.35 mm when unpressed. Circumference sticks out less than 2mm, and just tiny bit more than 1mm when pressed)
- any number of rectangular and round plexi frontplates and endplates, in 3 colors: fully transparent, reddish and green-darkgrey-ish color. These are cheaper than the Al case, so not a problem if there is some excess quantity
- everything is ready for the manufacture of cases based on 120x40x2.5mm profile
- somewhat delayed because of earlier main-connector struggle at VemsExecutives/HardwareDesign. It is sure that EC36 will be used anyway on some boards like
- CDI
- and medium-featureset (still awesome) ECM boards
- somewhat delayed because of earlier main-connector struggle at VemsExecutives/HardwareDesign. It is sure that EC36 will be used anyway on some boards like
In any case, manufacturing frontplates wouldn't hurt. Endplates will be needed for everything (manufacturing them soon is absolutely little risk).
Plan
- I haven't found many reasonable places to cast the small dongle "case". Since a nice dongle case seems tougher task than I thought, I keep looking for professional partners before tweaking myself.
- I found an PCI Apogel-E 2-component elastic stuff that should be suitable. Unfortunately very low viscosity before polymerizing.
- for 1-piece (CNC-ed) negative, the top surface must be flat. It would be a futuristic spaceship-like shape
- for 2-piece (CNC-ed) negative, there is some more shape freedom but more complexity too
- in any case, it will be interesting job to prevent leaking at the meeting point of the WBO2 connector and the negative
- try to find feasible case solution for a wider (than 114mm) board with SAAB70 connector
Candidates - for future
- Kulin Ferenc (MembersPage/Fero) (40 hrs/month)
- Rob Humphris (? hrs/month)
- Jörgen Karlsson. Good knowledge about the tools and procedures, good sense for the mechanical function of the finished product and cost for the solution. Fair sense of the estetics. But I'm not close to our current manufacturing facility and do not use the same primitive tools (like using Corel draw to make the parts.) as the manufacturing facility we are currently using. (40hrs/month)
nocandidates