GenBoard/VerThree layout changes, going towards v3.3

Developers use this page to take notes and lock the binaries for editing when there is developement, such as a new release.

This page is for onboard circuits and layout; New ways of using the board belongs to GenBoard/UnderDevelopment/FirmWare or their own topic (or OtherUses maybe).

The v3.2 quality is awesome. We just want very minor adjustments, and make sure not to break anything.

small PCB proposals

Changes that break solderpaste mask - no big deal

Significant change - thinking out loud

While this would cut down some manual work at assembly, it could cause problems with logistics, and there is some risk of unforeseeable effects.

Manufacturing preparations - basically as before

We dropped the idea to transfer the files to the PNP machine fully digitally

Picknplace related TODO

Siemens MS72K fiasco

It was a little (harmless) misunderstanding: the basic-like control-file is compatible with the older MS72k (2500 components/hour) machine, but they use the big brother HSF...whatever machine for the assembly of v3.2 board.

I got a floppy with the files on it and a (matching) ready assembled PCB so I can verify the format. Unfortunately cannot read the floppy I got ... zzz ... We checked in the machine. I'm afraid it is GCR format, not MFM (I'd need an amiga) because it's not just the filesystem. Winshit doesn't say a meaningful error message (as usual) but it's really not standard format, I tried to read on block level on linux and I got IO error as well.

A friend just told that it is very common that CNC machines use a special format that he can read / write (with a special floppy drive), so we'll try that.

I couldn't find much useful info about Siemens ms72k format. However PADS have a module to print to it, so a known (preferrably simple) design can be used an example. If you have PADS software or something existing in Siemens MS72k format please write on this page. It should only take 3 minutes to export a simple existing design into MS72K format so we can do our output formatting module.

DONE already:

more TODO:

We should be close, but the schematic should be checked. (manually, automatically.

ASAP TODO, GUYS please be quick. Thanks for the help, Jörgen, Keith

These are different wnen comparing the agnd nets of 232 and 227.

Component pin

c27 2

c77 2

c92 2

c96 1

r148 2

r67 1

r71 2

u13 11

u14 14

u7 11


somewhat later (after gerbers sent in):

why change?

v3.1 is very nice, and works very well. However stock is very low now, we should manufacture at least 90..105 v3.2 very soon: I already got the last pricy components for v3.2.

visibility of CAD files

Note that after GenBoard/VerThree stablized, there was a little change in eagle files visibility:

The schematics are on GenBoard/Manual/InitialTesting/VerThree (the PDF is searchable by component name), but the eagle is only used by the developers.

One can ask (eg. sometimes those who buy v3.x from WebShop ask).

Eagle version

Note that eagle 4.11r2 cannot open the file (complains about damaged file or something..), and eagle4.11 is not on cadsoft download site any longer. Someone uploaded a

from the previously availabe free c@dsoft download.
Working Cadsoft Links
[German 4.11 2003]
[English 4.11 2003]

v3.0 => v3.1 was mostly cosmetics, but the better clearance and the SMD inductors made the board nicer to work with.

I guess we want SMD crystal for v3.2. Throughole sucks, SMD is a million times better to work with, either automated or manually.

Note that with r180 we started v3.1. Some tiny PCB changes - the unused fill-lobes were cleaned. You should start from recent v3.1 when populating sections, and only check layout on r176 when you find components missing from v3.0 (rare)

Preparations for 3.3 with surface mounted switches.

Unfortunately I have no internet connection when I write this. It's based on my local datasheets and paper literature.

You probably missed discussion about this: GenBoard/VerThree/CustomCNCCase

Let's continue here: GenBoard/PowerSwitcher


There is ignition igbt's in DPAK and D2PAK formats, DPAK seem a bit uncommon but ISL9V3040 is available as TO220, DPAK, D2PAK and TO262AA(TO220 with SMD flange).

There may be a problem with distributor application with surface mount IGBT's. An coil on plug application or waste spark application distribute the load and heat over several IGBT's. We may want to make room for one or two hole mount IGBT's for these applications.

If someone want to use the ignition fets for other applications a hole mount diode can be soldered from drain to vbatt to provide a low voltage flyback. Rare case, no need for us to bother. Let em hack. We only add flyback option where there is enough space (actually, there is space on the top side).


I didn't find any DPAK FETs, but no worries, I only had two or three FET datasheets here while I had a bunch of IGBT data sheets. I'm sure that there is a ton of suitable FETs in DPAK package.

Provisions for flyback diodes is a must. I would like room for FAT hole mount components. I disagree. The FlyBack from SMB footprint diodes (and no resistors) work very nice. If someone wants PWMing and high voltage at the same time, he can do it with some external diodes. No need for throughole. That would partly kill the benefit of going to SMD-switches.

Do we want to add short circuit protection? I don't think so. (later, with the ARM: using similar circuitry as the 8 channel EGT).

Misc and Heater fets:

Only diode flyback. Short circuit protection?

D2PAK is a tight fit. It will probably work for IGBT and FET at the same time if we drop redundant components.

DPAK save a lot of space. It looks like we can easily fit everything. Surface mount components is mostly chilled by the footprint on the board and the smaller component leaves us room for more cooling surface. Cooling it by clamping something to the plastic of the component works better with D2PAK.

IRF7821 is a little SO-8 cased fet with amazing properties. Logic level control, MAX 12.5mOhm RDSon at 4.5Vgs, 30Vbr, 20C/W J-Drain lead, 50C/W j-ambient when mounted on 25square copper pattern, 11A continous with 70c ambient temp and before mentioned footprint. Slightly smaller footprint compared to DPAK.

Locking procedure

We store(d see the visibility notes above) the files as

Not obeying the filename convention will result in lost work or extra work to find out what's going on. Store/retreive files in the wiki:

Please follow this procedure:


The correct procedure to make a change in jurg.lbr is to aquire last known good version from me, talk to me, make changes, talk to me, send file to me.

Sly, since you're in the latest timezone, I expect you'll do the latest mods to v3.1 (and the gerbers) before production on Monday 6:40 GMT (8:40 GMT in the worst case). Wake me at 4AM GMT if you see something that is hard to judge: +3630 3433677. Thanx.

NOTE, this is the LIVE branch.

No uppercase characters in the filename please

please verify the old test-CAM (with gerbview) too.

If the above filename is newer than what's available under [uploaded files] than it is actually LOCKED, if the file is available, than RELEASED.

If the revision number of latest available file is higher than what's above, the highest number counts: for smaller changes not much risk of work-loss, so files can be uploaded without prev locking, but locking is nice).

TODO: pickNplace manufacturing requirements

I got a document, unfortunately in Hungarian. Nothing special, we should be close.

picnkplace types:


Please use 0.1u and 0.22u for cap values (while you do the review), forget the micro symbol.

200 below refers to the v3.1..r200.. series, currently r222

<cell> can someone explain C44 to me ?

<mik> hehe :)

<cell> I installed a short (also to SJ9) when I did EGT measurements

<mik> maybe it wants a capacitor to terminate the "gnd" input?

We should use a 0 ohm or a ferrite bead ? no!! we should connect GND and AGND via trace (right before generating gerbers, we want to leave the separation of GNDs for later eagle revisions)

crystal insulator: digi-key # 492-1039-ND (with the solderprotect and crystal on bottom I don't think we need too much fanciness, but ...)

TODO: v3.2 - later

TODO: sch, BOM, not urgent


TODO: dropped

  1. Data (red)
  2. Clock (blue
  3. GND (yellow)
  4. NC (keying)
  5. VCC (5V, green)

We could maybe use that on v3.1. Mik says no need to change it.

Holy batman, we're getting 2000 more FQPF.. FETs (ordered in 2004 March, scheduled for 2005 january, but they are hard to control, might drop in earlier :-(( ), although we have a lot in stock (appr. 1000, most at East Coast). What can we do with them? I really wanted to roll v3.3 and ARM boards with DPAK. Maybe we add some extra-fets near the edge :-)

Special thanx to

the v3.1 core HW engineers:

v3.1 manufacturing and WebShop:

other contributions: