No layout changes scheduled for next batch, so we keep the v3.3 name.

PNP proposal:

GenBoard/VerThree, no more layout changes since long (v3.3 in 2005 Aug), but some PNP components rethought

Developers use this page to take notes and lock the binaries for editing when there is developement, such as a new release.

This page is for onboard circuits and layout; New ways of using the board belongs to GenBoard/UnderDevelopment/FirmWare or their own topic (or OtherUses maybe).

PNP related

Significant change - DROPPED

While this would cut down some manual work at assembly, it could cause problems with logistics, and there is some risk of unforeseeable effects.


Files are stored in the developer file thingie and we all know the locking procedure.

As always: Not obeying the filename convention will result in lost work or extra work to find out what's going on.

UnLocked? Genboard v3.3. in SVN r555

Finalizing - make sure only bottom side changes and old components don't move because old top and cream will be used (and new bottom mask made)

That should be all, the rest should be OK, maybe review doesn't hurt.


Trigg2 input:

The somewhat strange layout of the trigg2 input is choosen to support the propriatory InputTrigger/AudiTrigger.

The conditioned VR signal and the HALL signal reach the MCU on the same (IC3) pin, as a "wired AND" gate: the HALL input will short (~mask out) the output from the LM1815 chip when they occur at the same time (yes, this is legal).

The VR TDC pin and the Hall Home signal occur at the same time every other revolution:

CAN transceiver: postponed

We'll probably make a CAN version later (S259_EN change effects firmware!), but we want v3.3 board v3.2 compatible from firmware point of view.

The CAN version will require it's own compiled firmware version because of the uC version change (that's OK, CAN justifies it). Supporting a 3d, intermediate firmware version with still atmega128 uC but the changed S259_EN is not feasible.

MCP2551 (compatible with others, such as AT6660) for networking between upcoming display and sensor boards

  • pretend the atmega128 is at90can128 (we'll populate 100 atmega128 and 40+ at90can128 in v3.3 series) and wire for real CAN. This allows talking to big boards like v3.3, all ARM and everything except lowend. The below would be fake-CAN (CAN on physical layer, UART on link level), that would be good to talking 115200 to lowend (ATMEGA88 based) boards.
  • DROPPED: replace DS2480B with differential transceiver (MCP2551). This means the not-so-many Ibutton users use v3.2 or connect the Ibutton indirectly, through a small atmega88 board like VemsFrontier/MiracleBoard with DS2480 and a differential transceiver)
  • DROPPED: or replace max232 with smaller max3311 to gain space (only 1st UART can talk RS232, the 2nd cannot: this makes sense)
  • DROPPED: or steal some of the top GND area (the SMB transient diode saves some space compared to the old thrughole) and add differential transceiver (MCP2551 SOIC8). That leaves 3 choices for 2nd UART: RS232 (MAX232) or 1wire (DS2480B) or differential (MCP2551): naturally only 1 usable at a time. A bit too flexible.

Plan was to make v3.3

Started some research on at90can128 compatibility. I was first horrified with

Firmware recompile (different released binary) would still be needed for the CAN uc.

Look for AVR096 at (doc4313) and the datasheets for more info.

Manufacturing preparations - basically as before

We dropped the idea to transfer the files to the PNP machine fully digitally

Picknplace related TODO


somewhat later (after gerbers sent in):

why change?

v3.1 is very nice, and works very well. However stock is very low now, we should manufacture at least 90..105 v3.2 very soon: I already got the last pricy components for v3.2.

visibility of CAD files

Note that after GenBoard/VerThree stablized, there was a little change in eagle files visibility:

The schematics are on GenBoard/Manual/InitialTesting/VerThree (the PDF is searchable by component name), but the eagle is only used by the developers.

One can ask (eg. sometimes those who buy v3.x from WebShop ask).

Eagle version

Note that eagle 4.11r2 cannot open the file (complains about damaged file or something..), and eagle4.11 is not on cadsoft download site any longer. Someone uploaded a

from the previously availabe free c@dsoft download.
Working Cadsoft Links
[German 4.11 2003]
[English 4.11 2003]

v3.0 => v3.1 was mostly cosmetics, but the better clearance and the SMD inductors made the board nicer to work with.

Note that with r245 we started v3.3. Some tiny PCB changes - the unused fill-lobes were cleaned. You should start from recent v3.1 when populating sections, and only check layout on r176 when you find components missing from v3.0 (rare)

Preparations for 3.3 with surface mounted switches.

Unfortunately I have no internet connection when I write this. It's based on my local datasheets and paper literature.

You probably missed discussion about this: GenBoard/VerThree/CustomCNCCase

Let's continue here: GenBoard/PowerSwitcher


There is ignition igbt's in DPAK and D2PAK formats, DPAK seem a bit uncommon but ISL9V3040 is available as TO220, DPAK, D2PAK and TO262AA(TO220 with SMD flange).

There may be a problem with distributor application with surface mount IGBT's. An coil on plug application or waste spark application distribute the load and heat over several IGBT's. We may want to make room for one or two hole mount IGBT's for these applications.

If someone want to use the ignition fets for other applications a hole mount diode can be soldered from drain to vbatt to provide a low voltage flyback. Rare case, no need for us to bother. Let em hack. We only add flyback option where there is enough space (actually, there is space on the top side).


I didn't find any DPAK FETs, but no worries, I only had two or three FET datasheets here while I had a bunch of IGBT data sheets. I'm sure that there is a ton of suitable FETs in DPAK package.

Provisions for flyback diodes is a must. I would like room for FAT hole mount components. I disagree. The FlyBack from SMB footprint diodes (and no resistors) work very nice. If someone wants PWMing and high voltage at the same time, he can do it with some external diodes. No need for throughole. That would partly kill the benefit of going to SMD-switches.

Do we want to add short circuit protection? I don't think so. (later, with the ARM: using similar circuitry as the 8 channel EGT).

Misc and Heater fets:

Only diode flyback. Short circuit protection?

D2PAK is a tight fit. It will probably work for IGBT and FET at the same time if we drop redundant components.

DPAK save a lot of space. It looks like we can easily fit everything. Surface mount components is mostly chilled by the footprint on the board and the smaller component leaves us room for more cooling surface. Cooling it by clamping something to the plastic of the component works better with D2PAK.

IRF7821 is a little SO-8 cased fet with amazing properties. Logic level control, MAX 12.5mOhm RDSon at 4.5Vgs, 30Vbr, 20C/W J-Drain lead, 50C/W j-ambient when mounted on 25square copper pattern, 11A continous with 70c ambient temp and before mentioned footprint. Slightly smaller footprint compared to DPAK.

Locking procedure

We store(d see the visibility notes above) the files as

Not obeying the filename convention will result in lost work or extra work to find out what's going on. Store/retreive files in the wiki:

Please follow this procedure:


The correct procedure to make a change in jurg.lbr is to aquire last known good version from me, talk to me, make changes, talk to me, send file to me. A bit of a annoyance to you guys but I have spent hours spending this library on several occations just because people make changes to outdated versions.

TODO: pickNplace manufacturing requirements

I got a document, unfortunately in Hungarian. Nothing special, we should be close.

picnkplace types:

TODO: v3.2 - later

TODO: sch, BOM, not urgent

TODO: dropped

  1. Data (red)
  2. Clock (blue
  3. GND (yellow)
  4. NC (keying)
  5. VCC (5V, green)

We could maybe use that on v3.1. Mik says no need to change it.

Holy batman, we're getting 2000 more FQPF.. FETs (ordered in 2004 March, scheduled for 2005 january, but they are hard to control, might drop in earlier :-(( ), although we have a lot in stock (appr. 1000, most at East Coast). What can we do with them? I really wanted to roll v3.3 and ARM boards with DPAK. Maybe we add some extra-fets near the edge :-)

Special thanx to

the v3.1 core HW engineers:

v3.1 manufacturing and WebShop:

other contributions: